SMD line 1
Absolute precision, maximum placement performance – top performance in these two disciplines make our SIPLACE X placement platform the first choice for demanding high-volume applications.
The SIPLACE X is used successfully wherever the highest placement performance, the lowest ppm rates, uninterrupted set-up changes, fast product launches (NPI) and the production-ready placement of ultra-small components of the latest generation (01005 (metric)) are required.
More details
the SMD-1 line
Board handling
- ASYS throughout
Paste printing
- EKRA X5 Professional with 2½ D paste inspection
- Stencil underside inspection
- Stencil cleaning system
- Alignment accuracy: ± 12.5 µm @ 6 sigma
Placement machines
- Siemens X4 with 4 SIPLACE high-performance CPP (12-fold) placement heads, placement performance: IPC value 82,000 cph
- Siemens X3 with 2 SIPLACE high-performance CPP (12-way) placement heads, one of them with a camera for pick and place applications and a TwinHead head , placement performance: IPC value 62,700 cph Component range 01005 up to 200 × 125 mm that can be fitted
Reflow oven
- SMT Quattro Peak L Plus (length 6265mm)
AOI
- Viscom S 3088 II with 8 cameras inline with repair ejection and good / bad sorting
Stencil cleaning machine
- Kolb PS 31
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