SMD line 1

Absolute precision, maximum placement performance – top performance in these two disciplines make our SIPLACE X placement platform the first choice for demanding high-volume applications.

The SIPLACE X is used successfully wherever the highest placement performance, the lowest ppm rates, uninterrupted set-up changes, fast product launches (NPI) and the production-ready placement of ultra-small components of the latest generation (01005 (metric)) are required.

More details
the SMD-1 line

Board handling

  • ASYS throughout

Paste printing

  • EKRA X5 Professional with 2½ D paste inspection
  • Stencil underside inspection
  • Stencil cleaning system
  • Alignment accuracy: ± 12.5 µm @ 6 sigma

Placement machines

  • Siemens X4 with 4 SIPLACE high-performance CPP (12-fold) placement heads, placement performance: IPC value 82,000 cph
  • Siemens X3 with 2 SIPLACE high-performance CPP (12-way) placement heads, one of them with a camera for pick and place applications and a TwinHead head , placement performance: IPC value 62,700 cph Component range 01005 up to 200 × 125 mm that can be fitted

Reflow oven

  • SMT Quattro Peak L Plus (length 6265mm)


  • Viscom S 3088 II with 8 cameras inline with repair ejection and good / bad sorting

Stencil cleaning machine

  • Kolb PS 31
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